TC600 High-Thermal-Conductivity PCB with Immersion Gold Finish
1.Product Overview
Rogers TC600 is a premium PTFE-based composite laminate engineered with thermally conductive ceramic fillers and woven glass reinforcement. Designed for high-power RF applications, this material delivers best-in-class thermal conductivity (1.1 W/mK) while maintaining excellent dielectric stability (Dk=6.15). The 2-layer construction features 1oz copper layers and immersion gold finish, making it ideal for compact power amplifiers, microwave combiners, and avionics systems.
2.Key Material Properties
High Dielectric Constant: 6.15 (stable from 1.8MHz to 10GHz)
Ultra-Low Loss: 0.0017-0.0020 dissipation factor
Superior Thermal Management: 1.1 W/mK conductivity
Temperature Stable: -75 ppm/°C ΔDk (-40°C to 140°C)
Moisture Resistant: 0.03% absorption
CTE Matched: 9/9/35 ppm/°C (X/Y/Z)
3.PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | TC600 |
| Layer Configuration | Double Sided |
| Board Dimensions | 76mm × 57mm (4 variants) |
| Dimensional Tolerance | ±0.15mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Via Type | Through-hole only (No Blind) |
| Finished Board Thickness | 1.6mm |
| Copper Weight (Outer Layers) | 1oz (35μm total) |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Silkscreen (Top/Bottom) | None / None |
| Solder Mask (Top/Bottom) | None / None |
| Quality Assurance | 100% Electrical Tested |
4.PCB Stackup: 2-layer rigid PCB
Copper layer 1 - 18 μm + 17μm plating
TC600 - 1.524 mm (60mil)
Copper layer 2 - 18 μm + 17μm plating
5.Board Statistics
Components: 24
Total Pads: 141
Thru Hole Pads: 65
Top SMT Pads: 76
Bottom SMT Pads: 0
Vias: 101
Nets: 2
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Thermal Performance: Reduces hot spots by 25-30% compared to standard materials
Size Reduction: Enables 20% smaller PCB footprints versus lower Dk substrates
Frequency Stability: <1% Dk variation across operating temperatures
Reliability: Matches CTE of active components for durable solder joints
8.Target Applications
Microwave Combiner and Power Divider Boards in Avionics Applications
Small Footprint Antennas
Digital Audio Broadcasting (DAB) Antennas(Satellite Radio)
GPS & Hand-held RFID Reader Antennas